Electronics Cooling: From the Chip to the Datacenter
- 1st Edition, Volume 62 - November 1, 2026
- Latest edition
- Editors: John Patrick Abraham, John M. Gorman, Kambiz Vafai
- Language: English
A concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling… Read more
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Description
Description
A concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling strategies, conduction, convection, liquid immersion, and phase change cooling, scale up to keep entire data centers reliable and energy-efficient. The book blends fundamentals (heat transfer, modeling, materials) with real-world design guidelines, case studies, and best practices for engineers, researchers, and students working on electronics cooling across all scales.
Key features
Key features
- From micro- and nano-scale cooling mechanisms at the chip level to macro-scale cooling in data centers
- Bridges fundamental heat transfer with system-level thermal management
- Detailed treatment of conduction, convection (natural and forced), radiation, phase change, and two/three-phase cooling
Readership
Readership
Academic researchers and graduate students, University libraries and research institutions
Table of contents
Table of contents
1. Passive Thermal Management of a Hard Disk Drive for Edge Appliances
Umesh Madanan, Shabeeh Kattakkadan, Nahoosh Mandlik and Niranjan Pol
2. TBD
Kambiz Vafai
3. TBD
Baghat Sammakia
4. TBD
Satish Kandlikar
5. TBD
Timothy S. Fisher
6. TBD
Ali Shakouri
7. TBD
Ahmet Mete Muslu
8. TBD
Ravi Mahajan and Rajiv Mongia
9. TBD
Wangda Zuo
10. Datacenters and cost analysis
Hyunjun Oh
Umesh Madanan, Shabeeh Kattakkadan, Nahoosh Mandlik and Niranjan Pol
2. TBD
Kambiz Vafai
3. TBD
Baghat Sammakia
4. TBD
Satish Kandlikar
5. TBD
Timothy S. Fisher
6. TBD
Ali Shakouri
7. TBD
Ahmet Mete Muslu
8. TBD
Ravi Mahajan and Rajiv Mongia
9. TBD
Wangda Zuo
10. Datacenters and cost analysis
Hyunjun Oh
Product details
Product details
- Edition: 1
- Latest edition
- Volume: 62
- Published: November 1, 2026
- Language: English
About the editors
About the editors
JA
John Patrick Abraham
John Abraham is at University of St. Thomas, Saint Paul, MN, USA
Affiliations and expertise
University of St. Thomas, Saint Paul, MN, USAJG
John M. Gorman
John Gorman is at University of Minnesota, Minneapolis, MN, USA
Affiliations and expertise
University of Minnesota, Minneapolis, MN, USAKV
Kambiz Vafai
Kambiz Vafai is a mechanical engineer, inventor, academic and author. He has taken on the roles of Distinguished Professor of Mechanical Engineering and the Director of Bourns College of Engineering Online Master-of-Science in Engineering Program at the University of California, Riverside. Vafai is most known for his pioneering work in phenomenological description, modeling and analysis for single and multiphase transport through porous media. His publications include journal articles and books such as Porous Media: Applications in Biological Systems and Biotechnology and the Handbook of Porous Media. Additionally, he is the recipient of the 75th Anniversary Medal of American Society of Mechanical Engineers (ASME) Heat Transfer Division in 2013, the 2006 ASME Memorial Award, and the 2011 International Society of Porous Media (InterPore) Honorary Lifetime Membership Award. Vafai is a Fellow of the American Society of Mechanical Engineers (ASME), the American Association for Advancement of Science (AAAS), the World Innovation Foundation, and Associate Fellow of American Institute of Aeronautics and Astronautics (AIAA). He has taken on the roles of Editor-in-Chief of the Journal of Porous Media and Special Topics and Reviews in Porous Media, Editor of International Journal of Heat and Mass Transfer and has held positions on the Editorial Advisory Board of the International Journal of Heat and Mass Transfer, International Communications in Heat and Mass Transfer, Numerical Heat Transfer Journal, International Journal of Numerical Methods for Heat and Fluid Flow, Experimental Heat Transfer Journal, and editorial board of the International Journal of Heat and Fluid Flow.
Contact Reference
167207
Contact TypePersonCategoryNo Category AssignedDivisionsElsevier
Affiliations and expertise
University of California, California, USA