Plasma Processing for Semiconductor Materials and Thin-Film Devices
- 1st Edition - November 2, 2026
- Latest edition
- Editors: Kuan Yew Cheong, Behnam Akhavan, Shih-Nan Hsiao, Sheng-Chi Chen, Phuoc Huu Le
- Language: English
Plasma Processing for Semiconductor Materials and Thin-Film Devices brings together the state-of-the art and the latest developments in the field of plasma processing of thin f… Read more
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Description
Description
Plasma Processing for Semiconductor Materials and Thin-Film Devices brings together the state-of-the art and the latest developments in the field of plasma processing of thin films. It focuses on fundamental plasma theory, plasma for advanced applications and advanced characterization techniques, plasma and performance of semiconductor devices, and plasma processing. The book provides an overdue investigation of the most recent developments in the area of plasma processing. It begins by considering the fundamental physics of plasma, then moves to advanced applications in processing of semiconductor materials and their relation to performance of semiconductor thin film devices. Subsequently it investigates the adoption of plasma for advanced (including thin film) characterization methods, and finally it addresses emerging plasma technologies such as liquid plasma, cold atmospheric plasma, and other advanced plasma techniques for thin film applications (such as energy, sensor, and environmental). This book will be of interest to students, researchers, and practitioners in any field that utilizes plasma processing, since its chapters have been written by leading authorities from both academia and industry.
Key features
Key features
- Brings together in one volume fundamental knowledge of thin film growth at the atomic scale, the macroscopic concepts of thin film growth, and the basic knowledge of plasma physics and chemistry
- Covers state-of-the-art plasma technology for processing and characterizing advanced and emerging semiconductor materials and thin film devices
- Explores a wide range of plasma technologies for advanced engineering applications
Readership
Readership
Senior students, post-docs, researchers, and professionals in basic and applied areas of plasma processing (eg, semiconductor development and fabrication, microelectronics)
Table of contents
Table of contents
Section I: Background and introduction to plasma science
1. Plasma physics and applications
2. Plasma diagnostic theory and methods
3. Modelling of plasma chemistry
Section II: Plasma processing: Thin Film Deposition
4. Advanced physical vapor deposition (HiPIMS, etc)
5. Advanced chemical vapor deposition (PE-ALD, etc)
6. A review on plasma enhanced atomic layer deposition for advanced thin film deposition
7. Plasma Jet Deposition
8. Simulation of plasma model for metallic thin film deposition
Section III: Plasma processing: Surface modification of thin films
9. Surface functionalization of narrow bandgap semiconductors
10. Surface functionalization of Si, SiGe, and Ge semiconductors
11. Surface functionalization of wide bandgap semiconductors
12. Surface functionalization of ultra-wide bandgap semiconductors
13. Surface functionalization of advanced polymeric materials
14. Surface functionalization of metallic surface modification
Section IV: Thin film etching and other plasma-enabled processes
15. Low temperature plasma etching technology
16. Etching technology for narrow bandgap semiconductor
17. Etching technology for Si, SiGe, and Ge semiconductor
18. Etching technology for wide bandgap semiconductor
19. Etching technology for ultra-wide bandgap semiconductor
20. Advances of plasma atomic layer etching technology
21. Plasma dicing technology
Section V: Energy, sensor and environmental applications of liquid plasma processing
22. Synthesis of semiconductor nanomaterials for energy applications
23. Environmental sensors via liquid plasma processing
Section VI: Other advanced (thin film) plasma processing methods
24. Cold atmospheric plasma
25. Laser induced plasma
26. Plasma for 3D printing
27. Development of advanced plasma technology for semiconductor device thin film applications
28. Advances of plasma etching technology for 3D advanced packaging for high density memory devices
Section VII: Plasmas for advanced and thin film characterization techniques
29. Glow Discharge Mass Spectrometry (GD-MS)
30. Glow Discharge Optical Emission Spectroscopy (GD-OES)
31. Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
32. Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
Section VIII: Plasma and performance of semiconductor thin film devices
33. Enhancement of device performance with plasma treatment
34. Plasma induced damages and material defects related to device performance
35. Plasma for wafer bonding
1. Plasma physics and applications
2. Plasma diagnostic theory and methods
3. Modelling of plasma chemistry
Section II: Plasma processing: Thin Film Deposition
4. Advanced physical vapor deposition (HiPIMS, etc)
5. Advanced chemical vapor deposition (PE-ALD, etc)
6. A review on plasma enhanced atomic layer deposition for advanced thin film deposition
7. Plasma Jet Deposition
8. Simulation of plasma model for metallic thin film deposition
Section III: Plasma processing: Surface modification of thin films
9. Surface functionalization of narrow bandgap semiconductors
10. Surface functionalization of Si, SiGe, and Ge semiconductors
11. Surface functionalization of wide bandgap semiconductors
12. Surface functionalization of ultra-wide bandgap semiconductors
13. Surface functionalization of advanced polymeric materials
14. Surface functionalization of metallic surface modification
Section IV: Thin film etching and other plasma-enabled processes
15. Low temperature plasma etching technology
16. Etching technology for narrow bandgap semiconductor
17. Etching technology for Si, SiGe, and Ge semiconductor
18. Etching technology for wide bandgap semiconductor
19. Etching technology for ultra-wide bandgap semiconductor
20. Advances of plasma atomic layer etching technology
21. Plasma dicing technology
Section V: Energy, sensor and environmental applications of liquid plasma processing
22. Synthesis of semiconductor nanomaterials for energy applications
23. Environmental sensors via liquid plasma processing
Section VI: Other advanced (thin film) plasma processing methods
24. Cold atmospheric plasma
25. Laser induced plasma
26. Plasma for 3D printing
27. Development of advanced plasma technology for semiconductor device thin film applications
28. Advances of plasma etching technology for 3D advanced packaging for high density memory devices
Section VII: Plasmas for advanced and thin film characterization techniques
29. Glow Discharge Mass Spectrometry (GD-MS)
30. Glow Discharge Optical Emission Spectroscopy (GD-OES)
31. Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
32. Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
Section VIII: Plasma and performance of semiconductor thin film devices
33. Enhancement of device performance with plasma treatment
34. Plasma induced damages and material defects related to device performance
35. Plasma for wafer bonding
Product details
Product details
- Edition: 1
- Latest edition
- Published: November 2, 2026
- Language: English
About the editors
About the editors
KC
Kuan Yew Cheong
Kuan Yew Cheong is a Professor in the School of Materials and Mineral Resources Engineering at Universiti Sains Malaysia (USM). He specializes in semiconductor materials, electronic packaging, nanomaterials, and surface engineering, recognized as a top 2% researcher in applied physics/materials (2023). He has contributed to research on bio-organic-based memory to address e-waste.
Affiliations and expertise
Professor, School of Materials and Mineral Resources Engineering, Universiti Sains MalaysiaBA
Behnam Akhavan
Behnam Akhavan is a Senior Lecturer of Biomedical Engineering at the University of Newcastle, Australia, where he heads the Plasma Bio-engineering Research Group. His Lab develops new plasma science and surface engineering solutions for a range of modern applications, including plasma surface engineering of bone implants, cardiovascular devices, and artificial nerves; plasma polymer nanoparticles for drug delivery; electrochromic coatings for wearable electronics; and micro/nano particles for toxin removal and water purification.
Affiliations and expertise
Senior Lecturer, School of Engineering, University of Newcastle, AustraliaSH
Shih-Nan Hsiao
Shih-Nan Hsiao is a Professor at the Center for Low-temperature Plasma Sciences, Nagoya University, Japan. His research interests include cryogenic plasma etching, atomic layer etching, plasma diagnostics, and simulations for semiconductor processes.
Affiliations and expertise
Professor, Center for Low-temperature Plasma Sciences, Nagoya University, JapanSC
Sheng-Chi Chen
Sheng-Chi Chen is a Professor in the Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on nanotechnology applications, particularly in the fields of information storage, transparent conductive oxide and nitride films, as well as magnetic films. He specializes in plasma and thin-film processes and analyses of nanomaterial thin films deposited via sputtering, evaporation, and atomic layer deposition (ALD) processes.
Affiliations and expertise
Professor, Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, TaiwanPL
Phuoc Huu Le
Phuoc Huu Le is an Associate Professor at the Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on the development and characterization of thin films, including thermoelectric materials, topological insulators, transparent conducting oxides, metal oxides, and half-Heusler compounds. He is also deeply engaged in the fabrication of nanomaterials through plasma-based and physical-chemical methods, with applications spanning photochemical water splitting, electrochemical sensors, and nanophotocatalysts for the degradation of emerging pollutants and contaminants.
Affiliations and expertise
Associate Professor, Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan