Reflow Soldering
Apparatus and Heat Transfer Processes
- 1st Edition - July 2, 2020
- Latest edition
- Authors: Balázs Illés, Oliver Krammer, Attila Geczy
- Language: English
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by… Read more
Data Mining & ML
Unlock the cutting edge
Up to 20% on trusted resources. Build expertise with data mining, ML methods.
Description
Description
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries.
Key features
Key features
- Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles
- Analyses and compares the different reflow ovens
- Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality
- Introduces Vapor Phase Soldering (VPS) technology
Readership
Readership
Researchers and process and quality engineers within the electronics and manufacturing industries
Table of contents
Table of contents
1. Introduction to Surface Mounting Technologya. Surface Mounted Devices (SMD)b. Solder paste and paste deposition technologiesc. Component placement methods d. The reflow soldering process (thermal profiles, Qη factor)e. Types of reflow apparatus and ovens (batch and conveyor types) f. Thermal profiling and fixing thermo-couples
2. Infrared ovensa. Physical background of infrared heatingb. Structure and working principle of infrared ovens (IR tubes and fans)c. Characterization of the heating in infrared ovensd. Typical soldering failures in the case of infrared heating
3. Convection ovensa. Physical background of convection heatingb. Structure and working principle of convection ovens (fan systems and nozzle matrix)c. Characterization of the flow parameters (flow velocity and temperature)d. Application of flow meters and inside camera systemse. Typical soldering failures in the case of convection heating
4. Vapor Phase Soldering (VPS) ovensa. Physical background of condensation heatingb. Structure and working principle of VPS ovens (heat transfer fluid, immersion heaters)c. Characterization of vapor parameters (concentration and temperature)d. Application of pressure sensorse. Special VPS options (soft and vacuum VPS options) f. Typical soldering failures in the case of condensation heating
5. Special reflow ovensa. Flux-less die attach technology by reflow solderingb. Forming gas ovensc. Formic acid ovensd. Characterization and measurements in special reflow ovens
6. Numerical simulation of reflow ovensa. Numerical simulations of infrared ovensb. Numerical simulations of convection ovensc. Numerical simulations of VPS ovensd. Numerical simulations of special ovens/apparatus
Product details
Product details
- Edition: 1
- Latest edition
- Published: July 2, 2020
- Language: English
About the authors
About the authors
BI
Balázs Illés
OK
Oliver Krammer
AG