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Elsevier

Books in Engineering and technology

The Engineering and Technology portfolio includes comprehensive overviews of all major research and practical developments in aerospace and automotive engineering, civil and environmental engineering, mechanical and industrial engineering, materials engineering, electrical engineering, communications engineering, and more. In-depth coverage, innovative state-of-the-art approaches, and real-world case studies provide valuable, actionable insights for researchers, applied engineers and students. The content in Elsevier's Engineering and Technology books program addresses core issues in industry and society, such as sustainability, the circular economy, AI, and automation.

  • Newnes Workshop Engineer's Pocket Book

    • 1st Edition
    • Roger Timings
    • English
    This Pocket Book is a unique compilation of all the tables, data, techniques, formulae and rules of thumb needed by mechanical engineers in the workshop, at work or at home. With content covering areas such as: workshop calculations and conversion tables; cutting tools; engineering materials; soldering fluxes, and O-rings, it will prove to be an essential tool for technicians, students, model engineers and DIY enthusiasts alike. British Standards are used and referenced throughout.Roger Timings has drawn on his unique practical experience as an engineer, lecturer, author and model engineer to select and bring together the information needed for practical workshop-based engineering. Most of the material in this book has been drawn from his definitive reference work Newnes Mechanical Engineer's Pocket Book, but it has been redrawn and redesigned for ease of reference in the workshop.With Newnes Workshop Engineer's Pocket Book, those undertaking workshop-based engineering projects now have all the key facts, figures, data and tables they need, together in one handy reference guide.

  • Encapsulation Technologies for Electronic Applications

    • 1st Edition
    • Haleh Ardebili + 1 more
    • English
    Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-s... (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packagin... (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechan... systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

  • Hot Embossing

    Theory and Technology of Microreplication
    • 1st Edition
    • Matthias Worgull
    • English
    This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to revolutionize a wide range of medical and industrial processes over the coming decade.The hot embossing process for replicating microstructures was developed by the Forschungszentrum Karlsruhe (Karlsruhe Institute of Technology) where the author is head of the Nanoreplication Group. Worgull fills a gap in existing information by fully detailing the technology and techniques of hot embossing. He also covers nanoimprinting, a process related to hot embossing, with examples of actual research topics and new applications in nanoreplication.

  • Rotational Molding Technology

    • 1st Edition
    • R.J. Crawford + 1 more
    • English
    This book clarifies and quantifies many of the technical interactions in the process. It distinguishes itself from other books on the subject by being a seamless story of the advanced aspects of the rotational molding process. There are seven chapters within the book. The US market for rotational molding products was one billion pounds in the year 2000. The growth of the rotational molding industry has grown at 10 to 15% per year. With this growth has come an increasing need for details on the complex, technical aspects of the process.

  • The Effect of Creep and Other Time Related Factors on Plastics and Elastomers

    • 2nd Edition
    • Laurence W. McKeen
    • English
    The second edition of the classic data book, The Effect of Creep and Other Time Related Factors on Plastics and Elastomers (originally published in 1991), has been extensively revised with the addition of an abundance of new data, the removal of all out-dated information, and the complete rebuilding of the product and company listings.This new edition also has been reorganized from a polymer chemistry point of view. Plastics of similar polymer types are grouped into chapters, each with an introduction that briefly explains the chemistry of the polymers used in the plastics. An extensive introductory chapter has also been added, which summarizes the chemistry of making polymers, the formulation of plastics, creep-testing, test methods, measurements, and charts, as well as theory and plastic selection.Each chapter is generally organized by product and concludes with comparisons of brand or generic products. The appendices include a list of trade names, plastics sold under those names, and manufacturer. A list of conversion factors for stress measures is also included.ABOUT THE AUTHORLaurence W. McKeen earned a B.S. in Chemistry from Rensselaer Polytechnic Institute in 1973 and a Ph.D. in 1978 from the University of Wisconsin. He began his career with DuPont in 1978 as a mass spectroscopist, but moved into product development in the Teflon® Finishes group in 1980. Dr. McKeen has accumulated over 28 years of experience in product development and applications, working with customers in a wide range of industries, which has led to the creation of dozens of commercial products.

  • Micromachining Using Electrochemical Discharge Phenomenon

    Fundamentals and Application of Spark Assisted Chemical Engraving
    • 1st Edition
    • Rolf Wuthrich + 1 more
    • English
    This book explains the fundamentals of SACE, promotes the technology, and encourages researchers and engineers from industry to use it for their specific applications. Therefore, the book, after presenting in details the fundaments of SACE (in particular the Electrochemical Discharges), deals mainly with practical aspects of implementing the machining technology. The book is written so that researchers from fields other than micro-technology (e.g., from life science) will be able to build a simple machining set-up, together with his mechanical work-shop, for individual needs.

  • Plastics in Medical Devices

    Properties, Requirements and Applications
    • 1st Edition
    • Vinny R. Sastri
    • English
    No book has been published that gives a detailed description of all the types of plastic materials used in medical devices, the unique requirements that the materials need to comply with and the ways standard plastics can be modified to meet such needs. This book will start with an introduction to medical devices, their classification and some of the regulations (both US and global) that affect their design, production and sale. A couple of chapters will focus on all the requirements that plastics need to meet for medical device applications. The subsequent chapters describe the various types of plastic materials, their properties profiles, the advantages and disadvantages for medical device applications, the techniques by which their properties can be enhanced, and real-world examples of their use. Comparative tables will allow readers to find the right classes of materials suitable for their applications or new product development needs.

  • Microfabrication for Industrial Applications

    • 1st Edition
    • Regina Luttge
    • English
    Microfabrication for Industrial Applications focuses on the industrial perspective for micro- and nanofabrication methods including large-scale manufacturing, transfer of concepts from lab to factory, process tolerance, yield, robustness, and cost. It gives a history of miniaturization, micro- and nanofabrication, and surveys industrial fields of application, illustrating fabrication processes of relevant micro and nano devices.Concerning sub-micron feature manufacture, the book explains: the philosophy of micro/ nanofabrication for integrated circuit industry; thin film deposition; (waveguide, plastic, semiconductor) material processing; packaging; interconnects; stress (e.g., thin film residual); economic; and environmental aspects.Micro/nanome... sensors and actuators are explained in depth with information on applications, materials (incl. functional polymers), methods, testing, fabrication, integration, reliability, magnetic microstructures, etc.

  • Handbook of Physical Vapor Deposition (PVD) Processing

    • 2nd Edition
    • Donald M. Mattox
    • English
    This updated version of the popular handbook further explains all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the new edition remains on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications, with additional information to support the original material. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called "war stories", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.

  • Multilayer Flexible Packaging

    Technology and Applications for the Food, Personal Care, and Over-the-Counter Pharmaceutical Industries
    • 1st Edition
    • John R. Wagner Jr.
    • John R. Wagner Jr.
    • English
    A comprehensive and highly practical survey of the materials, hardware, processes and applications of flexible plastic films. Aimed at a wide audience of engineers, technicians, managers, purchasing agents and users, Multilayer Flexible Packaging provides a thorough introduction to the manufacturing and applications of flexible plastic films, covering: Materials Hardware and Processes Multilayer film designs and applications The materials coverage includes detailed sections on polyethylene, polypropylene and additives. The dies used to produce multilayer films are explored in the hardware section, and the process engineering of film manufacture explained, with a particular focus on meeting specifications and targets. The section includes unique coverage of the problematic area of bending technology, providing a unique explanation of the issues involved in the blending of viscoelastic non-Newtonian polymeric materials. About the author John R. Wagner, Jr. is President of Crescent Associates, Inc., a consulting firm that specializes in plastic films and flexible packaging. He graduated from the University of Notre Dame with a BS and MS in Chemical Engineering.

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