TSV 3D RF Integration
High Resistivity Si Interposer Technology
- 1st Edition - April 27, 2022
- Latest edition
- Authors: Shenglin Ma, Yufeng Jin
- Language: English
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resi… Read more
World Book Day celebration
Where learning shapes lives
Up to 25% off trusted resources that support research, study, and discovery.
Description
Description
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.
A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.
Key features
Key features
- Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology
- Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods
- Offers a systematic and comparative literature review of HR-Si interposer technology by topic
- Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems
- Gives a systematic and accessible accounting on this leading technology
Readership
Readership
Engineers in microelectronics such as advanced package technology for 5G RF modules; graduate students working on microelectronics
Table of contents
Table of contents
1. Introduction to HR-Si Interposer Technology
2. Design, process and electrical verification of HR-Si interposer
3. Design, verification and optimization of novel vertical RF transmission structure in HR-Si interposer
4. HR-Si TSV integrated inductor
5. Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer
6. 3D heterogeneous RF integration oriented HR-Si interposer embedded with microchannel
7. Patch Antenna in Stacked HR-Si interposers
8. Through Glass Via Technology
9. Conclusion and outlook
Product details
Product details
- Edition: 1
- Latest edition
- Published: April 27, 2022
- Language: English
About the authors
About the authors
SM
Shenglin Ma
YJ